• Sheetfed machine with round-on-round technology
• Operational control similar to a sheetfed offset press
• Up to 12.000 s/h
• Unrivalled stamping quality
• Fast makeready = Reduced downtime & Increased productivity
• Unique technology for large runs, high volumes and
high quality requirements
• Up to 35% foil savings vs flat on flat foil stamping systems
• Minimum contact time between tools, foil and substrate
(<10% compared to flat/flat technology)
• No evaporation or gas bubbles
• Highest edge definition
• Ideal for printed subjects with large areas, for fine lines and
sensitive substrates. e.g. plastics, blister cards etc.
• Wide range of substrates from 40 gsm up to cardboard
• Continuous application pressure in nip line
• Highest stamping pressure (> 500 t)
• Minimum heat transmission onto delicate substrates e.g. polymers
• No extra tools or devices needed for heat protection
• Continuously rotating form and counter pressure cylinder = Perfect register from front edge to rear
• First sheet in register
• Perfect foil guidance across the entire sheet length
• Perfect lateral register and less foil waste